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Diamond Grinding Wheel For Sapphire Wafer Thinning Lapping

Metal bond Diamond Grinding wheel are used for back thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer rough grinding. Welcome to buy diamond grinding wheel for sapphire wafer thinning lapping from us.

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Hybrid Grinding Wheel

Hybrid grinding wheel is forturetools newly developed diamond wheel, which is specialized for carbide tools manufacturing, which can also be used for both Fresh tool manufacturing and re-sharpening, on CNC Tool and Cutter Grinders. With features of high stock removal rates, good cutting ability, easy dressing, higher productivity, Shorter process time, etc.

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Diamond And CBN Cut Off Wheels

Diamond and CBN cut off wheels are used for different material cutting and slotting usage, usually material like glass, ceramic,stone,carbide use diamond cutting wheel and CBN cutting wheel suit for material similar with steel.

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Super Thin Diamond Cut Off Wheel

Super thin diamond cut off wheel mainly used in glass, fine ceramics, magnetic materials, semiconductor packaging, electronic components, abrasive materials, hard alloys, etc.

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Diamond Centerless Grinding Wheel

Diamond centerless Grinding wheel are mainly used for grinding tungsten carbide, ceramics, magnetic material, stainless steel bar, PCD and PCBN composities.

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Half Segmented Diamond Cup Wheel For Glass

Half segmented diamond cup wheel is usually used for 2nd position of glass edging machine, after rough grinding of full segmented diamond cup grinding wheel.Half segmented diamond cup wheel for glass is suit for medium rough grinding of glass, diamond grain size usually 150# and 180# mesh. Popular size is 175 x 38x12x10x10mm

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