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Special Grinding Wheel For Ceramic Bond Grinding Sapphire

The Special Grinding Wheel For Ceramic Bond Grinding Sapphire is sintered by low-temperature vitrified bond and quality of high strength diamond powder, it has advantages of sharp grinding, high durability, grinding surface quality is good, easy to repair .

Micro Crystal Cutting Chip

The Micro Crystal Cutting Chip is a cutting grinding wheel which is made of high quality diamond and bronze bond by vacuum pressure sintering

Sapphire Cutter

The sapphire diamond bronze cutting knife has only a few sinks in the diamond metal bond part of the tool teeth. When in use, the slag drainage is low and the rotation speed is low. Bar material takes too long. At present, Sapphire Cutter usually takes about 1.5 hours to take out a 2 inch Xmm sapphire bar in China. Sapphire Cutter takes about 2.5 hours for a 4-inch Xmm bar to take about 3.5 hours..