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Resin Bond Diamond Grinding Wheel For Silicon Wafer

This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon, polycrystalline silicon grinding, and bevelling.As the professional manufacture, we would like to provide you resin bond diamond grinding wheel for silicon wafer. And we will offer you the best after-sale service and timely delivery.

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Product Description

Buy Discount Resin Bond Diamond Grinding Wheel For Silicon Wafer in China
This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon,polycrystalline silicon grinding and bevelling.

Standard size：200*62*80*5*7 and 200*62*80*15*10

Grit：100#—1000#

Following is the specification of this type of resin bond diamond grinding wheel for silicon wafer:

Silicon wafer grinding wheel size chart
Diameter	Thickness	Hole	Rim Width	Rim Thickness
200	35	76	3,5,6,9	3~8
200	50	80	3,5,6,9	3~8
200	60	80	3,5,6,9	3~8
220	65	180	3,5,6,9	3~8
300~350	20~40	127	5,7	3~8

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